DARPA Seeks White Papers on Advanced Microelectronics Technologies

The Defense Advanced Research Projects Agency has issued a broad agency announcement for advanced microelectronics solutions.

DARPA’s Microsystems Technology Office is seeking research ideas in four categories: embedded microsystem intelligence, next-front-end components for electromagnetic spectrum dominance, microsystem integration for better density and security and defense microsystem applications, Military & Aerospace Electronics reported.

For the embedded microsystems intelligence domain, MTO is seeking advancements in artificial intelligence processors, graphics processing units, machine autonomy, cognitive electronic warfare solutions and other microsystems technologies capable of learning.

The second focus area involves achieving better command, control, communications, computing, intelligence, surveillance and reconnaissance and electronic warfare capabilities. DARPA is also seeking research in new fabrication methods or positioning, navigation and timing technologies that can serve as an alternative for costly optical and radio frequency systems.

The third domain is focused on closing the gap between traditional manufacturing techniques and the use of lithography for building microelectronics.

Advancements in microsystem integration are expected to have applications in electronic design automation tools, trusted microelectronics and microsystem thermal management.

Lastly, MTO is seeking disruptive microsystem applications that can serve as the foundation for future C4ISR, electronic warfare and directed energy systems.

Companies have until Jan. 6, 2024, to submit abstracts and until March 16, 2024, to submit proposals.

Founded in 1991, DARPA’s MTO specializes in emerging technologies in fields such as microprocessors, microelectromechanical systems and photonic devices.

The organization’s work has resulted in advancements in wide-band-gap materials, phased array radars, high-energy laser weapons and infrared imaging.