Micross Components Secures $134M DOD Contract to Provide Advanced Packaging Capabilities

Chipmaker Micross Components announced that it has received a potential $134.3 million Department of Defense contract to deliver advanced packaging capabilities to support next-generation projects by the defense industrial base.

The award was made under the Industrial Base Analysis and Sustainment Cornerstone Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics program, Micross said Monday.

The DOD is obligated to provide Micross with $45.6 million at the time of the award.

Matthew Walsh, IBAS advanced packaging chief engineer at the Office of the Secretary of Defense, said the award is part of the RESHAPE effort to grow the United States’ advanced packaging manufacturing capabilities. The DIB will benefit from such processes being brought on-shore, he added.

Vincent Buffa, Micross’ CEO and chairman, said the award ensures that all programs of record have secure access to “advanced wafer-level interconnect and advanced packaging techniques” for chip wafers from all foundries.

According to Micross Senior Vice President Jeremy Adams, the Cornerstone RESHAPE award adds 300 millimeter wafer processing capabilities and expands 200 mm wafer production capacity for his company’s advanced interconnect technology organization.

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