NIST Selects SRC to Create Road Map for Microelectronics, Advanced Packaging Sector

The National Institute of Standards and Technology has selected Semiconductor Research Corporation, a high technology research consortium, to set the future technology goals for the microelectronics and advanced packaging technology industry.

Over 18 months, SRC will develop a manufacturing road map, identify necessary technologies and come up with ways to develop the workforce required to support the road map. NIST’s Advanced Manufacturing Office awarded $300,000 for the effort, SRC said Thursday.

SRC said that the project will support the MAPT industry’s efforts to advance new microelectronics applications and strengthen the microelectronics supply chain. 

The consortium added that it plans to work and build consensus with major industry stakeholders, including AMD, Intel, Texas Instruments, Purdue University, SUNY Binghamton and Georgia Institute of Technology. 

Minority-serving institutions such as Morgan State University and Hampton University will also play a key role in the development of a diverse workforce, SRC said. 

Todd Younkin, president and CEO of SRC, said that the consortium’s experience in facilitating interdisciplinary research makes it well-positioned to establish the MAPT industry’s direction.

“NIST’s recognition of our capabilities creates an exciting opportunity to establish essential research infrastructure in the field of microelectronics and advanced packaging technology,” Younkin added.

SRC chief scientist Victor Zhirnov said that NIST’s award is in line with the consortium’s 10-year plan, which highlights a need for more funding in the technology area. 

According to SRC’s Decadal Plan for Semiconductors, the semiconductor industry requires an additional $3.4 billion per year in federal investments to maintain U.S. leadership in information and communications technology.

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