White House Launches Program Ensuring US Remains World’s Advanced Packaging Leader
The Biden-Harris administration has launched a new program as part of an initiative to make the United States a global semiconductor manufacturing leader.
Speaking on the introduction of the National Advanced Packaging Manufacturing Program at Morgan State University on Monday, Laurie E. Locascio, undersecretary of commerce for standards and technology and National Institute of Standards and Technology director, said investing in domestic packaging capabilities is the first step in ensuring a healthy semiconductor sector in the country.
On Monday, the White House disclosed that it had set aside $3 billion in funding for the program to help the industry, NIST .gov reported.
The new program is among the four programs under CHIPS for America, an initiative that lends support to advancing the country’s semiconductor manufacturing capabilities.
In February, the Biden-Harris administration opened the first round of funding opportunities for the CHIPS program.
The federal government has been laying down components to ensure the success of CHIPS for America. Ramin Toloui, assistant secretary for the Bureau of Economic and Business Affairs at the Department of State, shared in May that the department is closely working with allies as it believes that global connections are vital in enhancing U.S. microchip manufacturing.
Category: Federal Civilian
Tags: CHIPS and Science Act federal civilian microelectronics National Advanced Packaging Manufacturing Program National Institute of Standards and Technology National Semiconductor Technology Center Research and Development semiconductor US Commerce